December 5, 2023 · Applied Cybernetics Group
CVE-2023-33063 — Qualcomm Multiple Chipsets
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
- Added to KEV
2023-12-05- Federal due date
2023-12-26- Vendor
- Qualcomm
- Product
- Multiple Chipsets
- EPSS
- 63.5th percentile (score 0.004, as of
2026-06-08) - NVD CVSS v3.1
- —
- Ransomware use
- Unknown
- Upstream
- https://nvd.nist.gov/vuln/detail/CVE-2023-33063
CISA short description
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Required action
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.